Features of SUMIDIA® Binderless :
・Fine grains of several tens of nanometers are firmly and directly bonded together.
・Harder than single-crystal diamond.
・No anisotropy and specific cleavage.
Features of BL-UPC® :
・Superior chipping and wear resistance to single-/polycrystalline diamond.
・Sharp cutting edge equivalent to UPC® (single-cystal diamond)
・Free from uneven wear caused by crystal orientation due to no anisotropy.
Please see the URL here.
http://www.allied-material.co.jp/english/products/diamond/cutting/blupc/
Post time: Jul-18-2017